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Manu Skyttä Starts as the President and CEO of Aspocomp Group Plc

05/20/2024 | GlobeNewswire
Manu Skyttä, MSc, Aeronautical Engineering, who was appointed as the new President and CEO of Aspocomp Group Plc in February, starts his position today. The Company issued a release on the appointment of Manu Skyttä on February 15, 2024.

High Density Packaging User Group Announces Shenzhen Kinwong Electronic Co., Ltd. Membership

05/20/2024 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that Shenzhen Kinwong Electronic Co., Ltd. (Kinwong) has become a member. 

TTM Technologies Appoints Wajid Ali to Board of Directors

05/10/2024 | TTM Technologies, Inc.
TTM Technologies, Inc. announced that Mr Wajid Ali has been appointed by the unanimous vote of the remaining Directors to serve as a new Class I director on the Board, effective immediately.

IPC Focuses on Education and Onboarding

05/09/2024 | Andy Shaughnessy, Design007 Magazine
I recently spoke with Carlos Plaza, senior director of education for IPC, about expanding educational efforts in the PCB design, fabrication, and assembly segments. As Carlos explains, PCB design is a hot topic, but onboarding may be the hottest one of all.

Governor of Virginia Visits Zollner

05/06/2024 | Zollner Elektronik AG
In the course of our business activities with Virginia Economic Development and the recent investments made in Leesburg and Danville, a visit with personal exchange followed on April 30, 2024.
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